Request a Quote on Boyd (Formerly Aavid) Part Number 342100F00000G and Other Heat Sinks Components Today

Mfg Part Number : 342100F00000G

Manufacturer : Boyd (Formerly Aavid)

Main Category : Thermal Management

Category : Heat Sinks

Sub Category : Fpga And Bga Heat Sinks

Description : Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications.

Unlimited Electromechanicals is your one-stop shop for Thermal Management components, such as those with the description “Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications..” You have reached the RFQ page for part number 342100F00000G, a Boyd (Formerly Aavid) listing that we currently have available for purchase on our website. Using the form that we have established below, you are always welcome to request a quote for your comparisons. Within 15 minutes of our staff receiving and reviewing the information you offer, you can expect to receive a response that accommodates your unique needs and restrictions alike while presenting competitive options for part number 342100F00000G.

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To ensure the caliber of this Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. item and other various Heat Sinks listings we offer, we enact rigorous quality assurance measures at every step of sourcing and fulfillment. For example, we choose to only stock items from vetted manufacturers we trust, such as Boyd (Formerly Aavid) and others. Furthermore, countless listings undergo varying levels of testing, inspection, and document verification to guarantee fit, form, and function for your benefit. With all of this in mind, begin the purchasing process for part number 342100F00000G, knowing that we will provide an optimal solution that is specifically tailored to you.

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